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An Update on Standards Activity for Txrf and the Challenges Ahead

Published online by Cambridge University Press:  06 March 2019

R. S. Hockett
R. S. Hockett*
Affiliation:
Charles Evans & Associates 301 Chesapeake Drive Redwood City, CA 94063
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Abstract

Standards organizations active in surface analysis using TXRF and VPD/TXRF include: (a) American Society for Testing and Materials (ASTM), (b) Semiconductor Equipment and Materials International (SEMI), (c) Ultra Clean Society of Japan (UCS), and (d) International Standards Organization Technical Committee 201 (ISO TC/201). The standards activities are presently dynamic, and they are on an international scale, This paper provides an update on the status of these activities, and presents the challenges ahead yet to be resolved.

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Type
Research Article
Information
Advances in X-Ray Analysis , Volume 39: Forty-Fourth Annual Conference on Applications of X-ray Analysis, July 31 - August 4, 1995 , 1995 , pp. 767 - 770
Copyright
Copyright © International Centre for Diffraction Data 1995

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References

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