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Macro and Micro-Stress Distributions in Filled Epoxy Systems

Published online by Cambridge University Press:  06 March 2019

L. T. Nguyen and
I. C. Noyan
L. T. Nguyen
Affiliation:
I.B.M. T. J. Watson Research Center P.O. Box 218 Yorktown Heights, N.Y. 10598
I. C. Noyan
Affiliation:
I.B.M. T. J. Watson Research Center P.O. Box 218 Yorktown Heights, N.Y. 10598
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Abstract

The results of an experimental study on residual stresses within the encapsulation layers of electronic components are described. For this study, silicon wafers were coated with a flexibilized cycloaliphatic formulation filled with 30 and 40 (vol.) % of Cu particles. The residual stresses were determined by measuring the radii of curvature of the encapsulated wafers. The stress in the Cu particles at the surface was also measured by X-Ray diffraction. It was seen that the stresses within the structure are primarily macro-stresses, with little stress present within the Cu particles. Comparison of the experimental values to those calculated from linear elasticity theory also indicate relaxation within the composite during curing.

Information

Type
III. X-Ray Stress/Strain Determination, Fractography, Diffraction, Line Broadening Analysis
Information
Advances in X-Ray Analysis , Volume 31: Thirty-Sixth Annual Conference on Applications of X-ray Analysis, August 3-7, 1987 , 1987, pp. 223 - 230
Copyright
Copyright © International Centre for Diffraction Data 1987

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References

1. Nguyen, L.T. and Noyan, L. C., “X-Ray Determination Of Encapsulation Stresses On Silicon Wafers,” to appear in Polytn. Eng. Sci. (3987).Google Scholar
2. Nguyen, L.T. and Kovac, C.A., “Moisture Diffusion In Electronic Packages; I. Transport Within Face Coatings,” SAM PE Electronics Materials Processes Conference, Santa Clara, June 23-25 (1987).Google Scholar
3. Noyan, L. C. and Cohen, J.B., Residual Stress - Interpretation And Measurement By X-Ray Diffraction, Springer-Verlag, in print (1987).Google Scholar
4. Nguyen, L.T., Poler, J.C., Buch, S.L. waiter, and Kovac, C. A., “Physical Properties of Cycloaliphatic Epoxide Formulations,” SPE 45th Annua! Technical Conference, Los Angeles, May 4-7 (1987).Google Scholar
5. Segmuller, A., Angilelo, J., and LaPIaca, S.J., “Automatic X-Ray Diffraction Measurement Of The Lattice Curvature Of Substrate Wafers For The Determination Of Linear Strain Patterns,” J. Appl Phys., 51, 6224 (1980).Google Scholar
6. Noyan, L. C. and Nguyen, L.T., “Residual Stresses In Polymeric Passivation And Encapsulation Materials,” to appear in Polym. Eng. Sci. (1987).Google Scholar
7. Nguyen, L.T. and Noyan, I.C., “Encapsulation Stresses In Filled Epoxy Systems, SPE Regional Technical Conference on Engineering Polymers And Composites, Chicago, September 23-24 (1987).Google Scholar
8. Mura, T., Micro mechanics Of Defects In Solids, Maitinus Nijhoff Publishers, The Hague, 364 (1982).Google Scholar
9. Goldsmith, C., Geldermans, P., Bedetti, F., and Walker, G.A., “Measurement Of Stresses Generated In Cured Polyimide Films,” J. Vac. Set., 1 (2), 407 (1983).Google Scholar