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Microstructural Characterization of Thin Polycrystalline Films by X-Ray Diffraction

Published online by Cambridge University Press:  06 March 2019

C.N.J. Wagner,
M.S. Boldrick and
L. Keller
C.N.J. Wagner
Affiliation:
Department of Materials Science and Engineering University of California, Los Angeles Los Angeles, CA 90024-1595
L. Keller
Affiliation:
Department of Materials Science and Engineering University of California, Los Angeles Los Angeles, CA 90024-1595
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Abstract

The Fourier analysis of the broadened profiles in a powder pattern allows the determination of the effective particle or domain size and the microstrains within each domain in polycrystalline materials. In order to apply this method to the diffraction patterns of thin films and coatings, deposited on crystalline or amorphous substrates, special diffraction techniques must be employed for the registration of the relatively weak intensities. The fitting of the experimental profiles to pseudo-Voigt functions permits the recovery of the peak tails and a precise determination of the background. The positions of the peak maxima or centroids yield information about any compositional variations, and about the occurrence of stacking faults and residual stresses in thin films and coatings.

Information

Type
II. Characterization of Thin Films by XRD and XRF
Information
Advances in X-Ray Analysis , Volume 31: Thirty-Sixth Annual Conference on Applications of X-ray Analysis, August 3-7, 1987 , 1987, pp. 129 - 142
Copyright
Copyright © International Centre for Diffraction Data 1987

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References

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