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X-ray Residual Stress Measurements Using Parallel Beam Optics

Published online by Cambridge University Press:  06 March 2019

Richard M. Chrenko
Richard M. Chrenko*
Affiliation:
General Electric Research and Development Center Schenectady, New York 12301
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Abstract

X-ray residual stress measurements have been made with a commercial portable X-ray diffraction apparatus that uses parallel beam optics and that was specifically designed for residual stress measurements. This machine differs from X-ray diffraction units using the usual parafocusing geometry in several respects, most notably reduced sample placement errors and larger sample sizes that can be accommodated. Two special modes of operation are available and will be discussed. These are the ability to use the side inclining method for stress analysis and the ability to use an oscillating ψ motion, the latter mode being useful for examining large grain size materials.

Information

Type
X-Ray Diffraction Stress Analysis
Information
Advances in X-Ray Analysis , Volume 20: Twenty-Fifth Annual Conference on Applications of X-ray Analysis, August 4-6, 1976 , 1976, pp. 393 - 402
Copyright
Copyright © International Centre for Diffraction Data 1976

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References

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