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Effect of Solid Solution Impurities on Dislocation Nucleation During Nanoindentation

Published online by Cambridge University Press:  01 August 2005

D.F. Bahr and
G. Vasquez
D.F. Bahr*
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
G. Vasquez
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
*
a) Address all correspondence to this author. e-mail: bahr@mail.wsu.edu
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Abstract

Dislocation nucleation in solid solutions of face-centered-cubic metallic materials was studied using nanoindentation. The effects of solute impurities in the copper–nickel system on the formation of dislocations in a previously dislocation-free region were demonstrated to be minimal. The shear stress required to nucleate dislocations in copper is approximately 1.6 GPa, while in nickel a 3.9 GPa shear stress is required. Changes in shear stress for nucleation track closely with changes in elastic modulus showing the nucleation stress is approximately 1/30 to 1/20 of the shear modulus. The expected solid-solution strengthening is identified within the same experimental method, demonstrating unambiguously the fact that solid-solution impurities in this system will impact the propagation of dislocations during plastic deformation but not alter the homogeneous nucleation of dislocations in these materials.

Keywords

DislocationsNanoindentation

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Type
Rapid Communications
Information
Journal of Materials Research , Volume 20 , Issue 8 , August 2005, pp. 1947 - 1951
Copyright
Copyright © Materials Research Society 2005

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