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Microstructure and strain in electrodeposited Cu/Ni multilayers

Published online by Cambridge University Press:  31 January 2011

David van Heerden,
Emil Zolotoyabko and
Dan Shechtman
David van Heerden
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Emil Zolotoyabko
Affiliation:
Department of Materials Engineering, Technion-Israel Institute of Technology, 32000 Haifa, Israel
Dan Shechtman
Affiliation:
Department of Materials Engineering, Technion-Israel Institute of Technology, 32000 Haifa, Israel
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Abstract

Electrodeposited Cu/Ni multilayers with different modulation lengths Λ = 4–18 nm were examined by means of x-ray diffraction and transmission electron microscopy. Preferred orientations of [111], [110], and [001]-types, as determined from relative x-ray diffraction peak intensities, were seen in the multilayers. By means of computer simulations of the measured x-ray diffraction spectra, several parameters of the multilayers, such as Λ-values and fluctuations ΔΛ, as well as lattice strain, were determined. Multilayers having large Λ were found to be fully relaxed due to interfacial dislocation formation. In short Λ [001]-texture multilayers partial strain relaxation occurs, probably due to the incorporation of Cu into the Ni layers. Both of the processes lead to the diffuse Cu/Ni interfaces. Short wavelength multilayers with a [111]-preferred orientation were almost fully strained. The importance of the [111]-texture in the improvement of mechanical strength of Cu/Ni multilayers resulting from its enhanced ability for stain accommodation is discussed.

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Type
Articles
Information
Journal of Materials Research , Volume 11 , Issue 11 , November 1996, pp. 2825 - 2833
Copyright
Copyright © Materials Research Society 1996

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