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Elastoplastic load–depth hysteresis in pyramidal indentation

Published online by Cambridge University Press:  31 January 2011

M. Sakai and
Y. Nakano
M. Sakai*
Affiliation:
Department of Materials Science, Toyohashi University of Technology, Tempaku-cho, Toyohashi 441–8580, Japan
Y. Nakano
Affiliation:
Department of Materials Science, Toyohashi University of Technology, Tempaku-cho, Toyohashi 441–8580, Japan
*
a)Address all correspondence to this author.msakai@tutms.tut.ac.jp
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Abstract

Extensive indentation tests were conducted for nineteen different engineering materials ranging from brittle to ductile materials, and including hard ceramics, ductile metals, and a soft organic polymer. Three tetrahedral pyramid indenters with specific face angles β [shallow pyramid (β = 10°), Vickers (β = 22°), and sharp pyramid (β = 40°) indenters] were used. All the materials tested were subjected to the quadratic load P and penetration depth h relationship P = k1h2 on loading, and most of the tested materials to the quadratic unloading relationship of P = k2(h − hr)2 with the residual depth hr after a complete unload. To determine the contact area at peak indentation load, a specially designed depth-sensing instrument was constructed, on which the contact behavior during loading/unloading was examined by through thickness observation of transparent specimens. All the characteristic indentation parameters were investigated on the basis of simple elastoplastic model, and correlated well with the nondimensional strain E′ tan β/H, in which the elastic modulus E′ was a measure for elasticity, true hardness H was a measure for plasticity, and the inclined face angle β characterized the indenter. The ratio of the conventional Meyer hardness HM to the true hardness H of the materials tested ranged from 0.2 to 0.9 as a function of E′ tan β/H. The cavity model suggested that true hardness H is expressed by the yield stress Y through a constraint factor C as H = C · Y with C ≈ 5.

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Articles
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Journal of Materials Research , Volume 17 , Issue 8 , August 2002, pp. 2161 - 2173
Copyright
Copyright © Materials Research Society 2002

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