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Microstructural evolution and piezoelectric properties of thick Pb(Zr,Ti)O3 films deposited by multi-sputtering method: Part I. Microstructural evolution

Published online by Cambridge University Press:  18 July 2011

Chee-Sung Park
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea
Jae-Wung Lee
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea
Gun-Tae Park
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea
Hyoun-Ee Kim*
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea
Jong-Jin Choi
Affiliation:
Department of Future Technology, Korea Institute of Machinery and Material, Chang-Won, Gyeong-Nam 641-831, Korea
*
a) Address all correspondence to this author. e-mail: kimhe@snu.ac.kr
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Abstract

Thick and crack-free Pb(Zr,Ti)O3 [PZT] films were fabricated on platinized silicon substrates by a multisputtering technique. The PZT films were deposited on the Si substrate by the radio frequency magnetron sputtering method using a single oxide target. As the film became thicker, its grain size increased. Therefore, the microstructure of the film was able to be controlled by repeatedly depositing thin layers. In addition, by using a seed layer with the same composition but a much smaller grain size, it was possible to further reduce the grain size of the film. When the film had a small in-plane grain size and a fibrous columnar structure, it was highly resistant to cracking, presumably because of its enhanced strength and structural stability. By exploiting these phenomena, highly dense, crack-free, and thick PZT films were successfully deposited up to a thickness of about 5 μm. The evolution of the crystallographic orientation of the film as a function of its thickness was also observed and correlated with the total strain energy of the system.

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Copyright
Copyright © Materials Research Society 2007

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