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Subcritical crack growth along epoxy/glass interfaces

Published online by Cambridge University Press:  31 January 2011

K.M. Conley,
J.E. Ritter and
T.J. Lardner
K.M. Conley
Affiliation:
Department of Mechanical Engineering, University of Massachusetts, Amherst, Massachusetts 01003
J.E. Ritter
Affiliation:
Department of Mechanical Engineering, University of Massachusetts, Amherst, Massachusetts 01003
T.J. Lardner
Affiliation:
Department of Mechanical Engineering, University of Massachusetts, Amherst, Massachusetts 01003
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Abstract

Subcritical crack growth behavior along polymer/glass interfaces was measured for various epoxy adhesives at different relative humidities. A four-point flexure apparatus coupled with an inverted microscope allowed for observation in situ of the subcritical crack growth at the polymer/glass interface. The specimens consisted of soda-lime glass plates bonded together with epoxy acrylate, epoxy (Devcon), or epoxy (Shell) adhesives. Above a threshold strain energy release rate, the subcritical crack velocity was dependent on the strain energy release rate via a power law relationship where the exponent was independent of the adhesive tested and the test humidity (n = 3). However, the multiplicative constant A in the power law relation varied by over three orders of magnitude between the various adhesives with epoxy (Shell) having the smallest value and the epoxy (Devcon) the greatest value; in addition, A was very sensitive to humidity, decreasing by over two orders of magnitude from 80% to 15% relative humidity. At high strain energy release rates, the subcritical crack velocity reached a plateau at approximately 10−6 m/s. The use of this subcritical crack velocity data in predicting thin film delamination is discussed.

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Type
Articles
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Journal of Materials Research , Volume 7 , Issue 9 , September 1992, pp. 2621 - 2629
Copyright
Copyright © Materials Research Society 1992

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