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Adhesion Improvement of Polyimide/PDMS Interface by Polyimide SurfaceModification

Published online by Cambridge University Press:  26 January 2016

Shivani Joshi ,
Antonie van Loon ,
Angel Savov  and
Ronald Dekker
Shivani Joshi*
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands Philips Research Eindhoven, High Tech Campus 4, 5656AE, Eindhoven, The Netherlands
Antonie van Loon
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands
Angel Savov
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands Philips Research Eindhoven, High Tech Campus 4, 5656AE, Eindhoven, The Netherlands
Ronald Dekker
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands Philips Research Eindhoven, High Tech Campus 4, 5656AE, Eindhoven, The Netherlands
*
*(Email: shivani.joshi@philips.com)
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Abstract

Silicon wafers coated with a 5μm thick layer of polyimide were treatedwith different surface modification techniques such as chemical adhesionpromoters, oxygen plasma and an Ar+ sputter etch. Aftersurface modification, the wafers were molded with a 1mm thick layer of PDMS. Theadhesion of the PDMS was tested by peel testing and by using a Nordson DAGEwedge shear tester. It was found that commercially available chemical adhesionpromoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion,whereas the Ar+ sputter etch resulted in an adhesion sostrong that the PDMS could not be delaminated from the PI surface without thefailure of the material.

Keywords

polymeradhesionsputtering

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Type
Articles
Information
MRS Advances , Volume 1 , Issue 1: Biomaterials and Soft Materials , 2016 , pp. 33 - 38
Copyright
Copyright © Materials Research Society 2016 

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References

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