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Advances in Characterization of CMP Consumables

Published online by Cambridge University Press:  31 January 2011

Mansour Moinpour,
Alex Tregub,
Andrea Oehler and
Ken Cadien
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Abstract

Chemical–mechanical polishing, or planarization (CMP), has emerged as an increasingly important technology for integrated-circuit manufacturing. Consumables used during CMP interact in a complex manner with the polishing tool, the process conditions, and the wafer being polished. In this article, several advanced analytical methods are used to analyze the properties of slurries and pads under conditions similar to those found during CMP processing. Some of the key findings are that under these process conditions, pads can be stabilized with a heat treatment prior to installation on the polisher; pads absorb slurries at different rates, and slurries also react with the pads; and the mechanical properties of the pads are dependent on the orientation of the grooves on the pad. Dynamic rheometry was used to detect de-agglomeration in sheared slurries.

Keywords

chemical–mechanical planarizationchemical–mechanical polishingCMPconsumablesintegrated-circuit (IC) fabricationpolymer characterizationrheology.

Information

Type
Research Article
Information
MRS Bulletin , Volume 27 , Issue 10: Advances in Chemical-Mechanical Planarization , October 2002, pp. 766 - 771
Copyright
Copyright © Materials Research Society 2002

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