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Computer Modeling and Numerical Simulation of Microwave Heating Systems

Published online by Cambridge University Press:  29 November 2013

Magdy F. Iskander
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Computer modeling and simulation of microwave processing systems provide significant advantages that are expected to play an important role in the development, scale-up, commercialization, and effective utilization of microwave heating technology. These advantages include the following:

• Understanding of the physical aspects of microwave interaction with materials. Microwave heating is a complex process, and computer modeling may help identify the role of materials properties, dimensions, input power, heating rates, etc. on the effective use of microwave heating procedures. Hybrid microwave heating often refers to the use of SiC rods, or lining the insulation surrounding the sample with thin SiC coatings, to help stimulate the microwave heating process. This is particularly important when microwaves are used to sinter low-loss materials that do not effectively absorb electromagnetic radiation. This complex hybrid heating process may lead to unpredictable results in routine microwave heating experiments; and many aspects of its procedure may be simulated, evaluated, and possibly optimized using computer modeling. For example, the number, dimensions, and locations of SiC rods in a typical picketfence arrangement and the thickness of SiC sheets that may be used to allow effective stimulation of the heating process, while still not shielding the sample from the microwave energy, may be better understood, and guidelines for experimentations may be developed using numerical simulation.

Information

Type
Microwave Processing of Materials
Information
MRS Bulletin , Volume 18 , Issue 11 , November 1993 , pp. 30 - 36
Copyright
Copyright © Materials Research Society 1993

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References

1.Iskander, M.F., Andrade, O., Virkar, A., and Kimrey, H., in Microwaves: Theory and Application in Materials Processing, edited by Clark, D.E., Gac, F.D., and Sutton, W.H. (Am. Ceram. Soc., Ceram. Trans. 21, Westerville, OH, 1991) p. 35.Google Scholar
2.Chaussecourte, P., Lamaudiere, J.F., and Maestrali, B., in Microwave Processing of Materials III, edited by Beatty, R.L., Sutton, W.H., and Iskander, M.F. (Mater. Res. Soc. Symp. Proc. 269, Pittsburgh, PA, 1992) p. 69.Google Scholar
3.Lorenson, C. and Gallerneault, C., in Microwaves: Theory and Application in Materials Processing, in Reference 1, p. 193.Google Scholar
4.Manring, B. and Asmussen, J. Jr., in Reference 1, p. 159.Google Scholar
5.Barmatz, M. and Jackson, H.W., in Microwave Processing of Materials III, in Reference 2, p. 97.Google Scholar
6.Iskander, M.F., Smith, R.L., Andrade, O., Kimrey, H., and Walsh, L., IEEE Trans. Microwave Theory Tech. (to be published).Google Scholar
7.Iskander, M.F., in Microwave Processing of Materials II, edited by Snyder, W.B., Sutton, W.H., Iskander, M.F., and Johnson, D.L. (Mater. Res. Soc. Symp. Proc. 189, Pittsburgh, PA, 1991) p. 149.Google Scholar
8.Cherry, P.C. and Iskander, M.F., IEEE Trans. Microwave Theory Tech. 40 (1992) p. 1692.CrossRefGoogle Scholar
9.Chapman, B., Iskander, M.F., Smith, R.L., and Andrade, O.M., in Reference 2, p. 53.Google Scholar
10.Newman, J.D., Walsh, L., Evans, R., Tholen, T., Andrade, O.M., Iskander, M.F., Bunch, K.J., and Kimrey, H., in Microwaves: Theory and Application in Materials Processing II, edited by Clark, D.E., Laia, J.R., and Tinga, W.R. (Am. Ceram. Soc., Ceram. Trans. 36, Westerville, OH, October 1993) (in press).Google Scholar
11.Navarro, A., Nunez, M.J., and Martin, E., IEEE Trans. Microwave Theory Tech. 39 (1991) p. 14.CrossRefGoogle Scholar
12.Iskander, M.F, in Reference 10.Google Scholar
13.Kimrey, H.D. and Janney, M.A., in Microwave Processing of Materials, edited by Sutton, W.H., Brooks, M.H., and Chabinsky, I.J. (Mater. Res. Soc. Symp. Proc. 124, Pittsburgh, PA, 1988) p. 367.Google Scholar
14. Parker liquid-crystal inks on plastic film, Edmund Scientific Co., 7785 Edscorp Building, Barrington, New Jersey 08007.Google Scholar
15.Roussy, G., Agbossou, K., Dichtel, B., and Thiebaut, J-M., J. Microwave Power and Electro-magnetic Energy 27 (3) (1992) p. 164.CrossRefGoogle Scholar
16.Roussy, G., Dichtel, B., and Agbossou, K., French Patent No. 91-13194 (October 1991).Google Scholar
17.Wickersheim, K.A. and Sun, M.H., 5th Natl. Conf. on High-Power Microwave Technol., U.S. Military Academy, West Point, NY, 1990.Google Scholar
18.Smith, R.L., Iskander, M.F., Andrade, O.M., and Kimrey, H., in Reference 2, p. 47.Google Scholar
19.Metaxas, A.C. and Meredith, R.J., Industrial Microwave Heating (Peter Peregrinus Ltd. on behalf of IEEE, London, 1983).Google Scholar
20.Janas, V.F., Malarkey, C.J., Iskander, M.F., Andrade, O.M., and Bringhurst, S., in Reference 10.Google Scholar
21.Tucker, J., Smith, R., Iskander, M.F., and Andrade, O.M., in Reference 2, p. 61.Google Scholar
22.Andrade, O.M., Iskander, M.F., and Bringhurst, S., in Reference 2, p. 527.Google Scholar
23.Bringhurst, S., Iskander, M.F., and Andrade, O.M., in Reference 10.Google Scholar
24.Janney, M.A., Kimrey, H.D., and Kiggans, J.O., in Reference 2, p. 173.Google Scholar
25.Durney, C.H., Iskander, M.F., Massoudi, H., and Johnson, C.C., IEEE Trans. Microwave Theory Tech., MTT-27 (1979) p. 758.CrossRefGoogle Scholar
26.Chen, H.Y., Iskander, M.F., and Penner, J.E., Appl. Opt. 30 (12) (1991) p. 1547.CrossRefGoogle Scholar
27.Iskander, M.F., Comp. Appl. Eng. Ed. 1 (1) (1992) p. 33.CrossRefGoogle Scholar
28.Iskander, M.F., Electromagnetic Fields and Waves (Prentice Hall, Englewood Cliffs, New Jersey, 1992).Google Scholar
29.Iskander, M.F., Reed, T., and Breen, J. III, Comp. Appl. Eng. Ed. 1 (2) (1993) p. 147.CrossRefGoogle Scholar
30.Iskander, M.F., IEEE Trans. Microwave Theory Tech. 41 (6) (June 1993).CrossRefGoogle Scholar
31.Computer Applications in Engineering Education (ISSN 1061-3773), John Wiley & Sons, Inc., 605 Third Avenue, New York, New York 10158-0012.Google Scholar