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A Soft Solution Processing Technique for Preparing Ferrite Films and Their Applications

Published online by Cambridge University Press:  31 January 2011

Masanori Abe
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“Ferrite plating” is a typical “soft solution processing” (SSP) application; it enables the formation of oxide ferromagnetic films from an aqueous solution at T 24−100°C under atmospheric pressure. Using ferrite plating, we can grow crystallized ferrite films of spinel-type (MFe)3O4 (where M = Fe, Co, Ni, Zn, Al, Cr, etc.) in one step, requiring no heat treatment. This opens the door to fabricating novel ferritefilm devices using substrates of such nonheat-resistant materials as plastics and GaAs integrated circuits; conventional ferrite-film preparation techniques, such as sputtering, vacuum evaporation, molecularbeam epitaxy, liquid-phase epitaxy, and so on, require high temperatures (>∼600°C) for the crystallization of ferrites, which deteriorates the non-heat-resistant substrates. Ferrite plating is a unique technique that allows us to synthesize ferrite “films” by means of a wet chemical process. There are many techniques, for synthesizing ferrite “particles” from aqueous solutions, but no technique, to our knowledge, enables ferrite-film synthesis by a wet chemical process.

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Type
Research Article
Information
MRS Bulletin , Volume 25 , Issue 9: Soft Processing for Advanced Inorganic Materials , September 2000 , pp. 51 - 55
Copyright
Copyright © Materials Research Society 2000

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References

1.Abe, M. and Tamaura, Y., Jpn. J. Appl. Phys., Part 2: Lett. 22 (1983) p. L511.Google Scholar
2.Abe, M., Itoh, T., and Tamaura, Y., Thin Solid Films 216 (1992) p. 155.CrossRefGoogle Scholar
3.Abe, M., in Proc. 6th Int. Conf. on Ferrites, Tokyo and Kyoto, (1992) p. 472.Google Scholar
4.Abe, M., J. Phys. IV (France) 7 Colloque C1 (Supplement au J. de Phys. III de mars 1997, Proc. ICF 7, 1996) (1997) p. 467.Google Scholar
5.Tamaura, Y., Chyo, G.S., and Katsura, T., Water Res. 13 (1979) p. 21.CrossRefGoogle Scholar
6.Yoshimura, M., Suchanek, W., and Han, K.-S., J. Mater. Chem. 9 (1999) p. 77.CrossRefGoogle Scholar
7.Pourbaix, M., Atlas of Electrochemical Equilibria (Pergamon Press, London, 1966) p. 312.Google Scholar
8.Nishimura, K., Kitamoto, Y., and Abe, M., IEEE Trans. Magn. 35 (1999) p. 3043.CrossRefGoogle Scholar
9.Nishimura, K., Matsushita, N., Kitamoto, Y., and Abe, M., to be presented at the International Ferrite Conference, Kyoto, Japan, September (2000) Paper No. 19PpI-7.Google Scholar
10.Abe, M., Kitamoto, Y., Matsumoto, K., Zhang, M., and Li, P., IEEE Trans. Magn. 33 (1997) p. 3649.CrossRefGoogle Scholar
11.Abe, M., Tamaura, Y., Oishi, M., Saitoh, T., Itoh, T., and Gomi, M., IEEE Trans. Magn. 23 (1987) p. 3432.CrossRefGoogle Scholar
12.Itoh, T., Hori, S., and Abe, M., J. Appl. Phys. 69 (1991) p. 5911.CrossRefGoogle Scholar
13.Hori, S., Itoh, T., Abe, M., and Tamaura, Y., Jpn. J. Appl. Phys., Part 1 31 (1992) p. 1185.CrossRefGoogle Scholar
14.Abe, M. and Tamaura, Y., J. Phys. IV (France) 7 Colloque, (Supplement au J. de Phys. III de mars 1997, Proc. ICF 7, 1996) (1997) p. 655.Google Scholar
15.Abe, M., Doi, T., Ishihara, T., Kitamoto, Y., and Unuma, H., J. Mag. Soc. Jpn. 22 (Suppl. S1) (1998) p. 446.Google Scholar
16.Fukumori, Y., Oyanagi, H., Yoshimatsu, K., Noguchi, Y., and Fujiwara, T., J. Phys. IV (France ) 7 Colloque C1 (Supplement au J. de Phys. III de mars 1997, Proc. ICF 7, 1996) (1997) p. 659.Google Scholar
17.Nagahata, S., Sasaki, M., Yoshioika, K., Anan, M., and Abe, M., in Proc. 6th Int. Conf. on Ferrites Tokyo and Kyoto (1992) p. 279.Google Scholar
18.Nishizono, I., Iida, S., Suzuki, N., Kawada, H., Murakami, H., Ashihara, Y., and Okada, M., Clin. Chem. 37 (1991) p. 1639.CrossRefGoogle Scholar
19.Ojima, M., Shirasaki, F., Kitamoto, Y., and Abe, M., IEEE Trans. Magn. 35 (1999) p. 4118.CrossRefGoogle Scholar
20.Zhang, M., Itoh, T., and Abe, M., Jpn. J. Appl. Phys., Part 1 36 (1997) p. 243.CrossRefGoogle Scholar
21.Ishikawa, K., Ohishi, M., Saitoh, T., Abe, M., and Tamaura, Y., Dig. Intermag. Conf., Kyoto, EB-04 (1987).Google Scholar
22.Miyawaki, F., Ysuji, T., Abe, M., and Kaibara, M., in Proc. XIII World Congress of Cardiology (1998) p. 1133.Google Scholar
23.Kitamoto, Y., Kantake, S., Shirasaki, F., Abe, M., and Naoe, M., J. Magn. Magn. Mater. 193 (1999) p. 97.CrossRefGoogle Scholar
24.Kitamoto, Y., Zhang, F., Kantake, S., Shirasaki, F., Abe, M., and Naoe, M., IEEE Trans. Magn. 35 (1999) p. 2694.CrossRefGoogle Scholar
25.Zhang, F., Kantake, S., Kitamoto, Y., and Abe, M., IEEE Trans. Magn. 35 (1999) p. 2751.CrossRefGoogle Scholar
26.Zhang, F., Kitamoto, Y., Abe, M., and Naoe, M., J. Appl. Phys. 87 (2000) p. 6881.CrossRefGoogle Scholar
27.Kitamoto, Y., Zhang, F., Abe, M., and Naoe, M., J. Appl. Phys. 87 (2000) p. 6878.CrossRefGoogle Scholar
28.Hori, S., Itoh, T., Abe, M., and Tamaura, Y., J. Magn. Soc. Jpn. 16 (1992) (in Japanese) p. 223.CrossRefGoogle Scholar
29.Talisa, S.H., Yoo, K.C., Abe, M., and Itoh, T., J. Appl. Phys. 64 (1998) p. 5819.CrossRefGoogle Scholar