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Ablation Lithography for TFT-LCD

Published online by Cambridge University Press:  17 March 2011

Kenkichi Suzuki,
Nobuaki Hayashi,
Hiroshi Masuhara and
Thomas K. Lippert
Kenkichi Suzuki
Affiliation:
Displays, Hitachi, Ltd., 3300 Hayano, Mobara, Japan
Nobuaki Hayashi
Affiliation:
Displays, Hitachi, Ltd., 3300 Hayano, Mobara, Japan
Hiroshi Masuhara
Affiliation:
Applied Physics Department, Osaka University, Suita, Osaka, Japan
Thomas K. Lippert
Affiliation:
Paul Scherrer Institut, CH-5232 Villigen PSI, Switzerland
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Abstract

Ablation lithography is based on the photo-decomposition ablation of polymer materials by excimer laser. It is a self-development process, and accordingly possible to reduce the throughput time and manufacturing cost of TFT-LCD. The major alterations from the conventional photolithography are the resist material and the mask. Developing both the technologies and using an experimental exposure& aligner, we fabricated a TFT pattern on 300 × 400 mm2 glass substrate. The result proves the feasibility of EAL as an high throughput lithography suitable for a-Si TFT.

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