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Capillary Stress in Microporous Thin Films

Published online by Cambridge University Press:  15 February 2011

J. Samuel,
A. J. Hurd,
C. J. Brinker,
L. J. Douglas Frink and
F. Van Swol
J. Samuel
Affiliation:
Ceramic Processing Science Department, Sandia National Laboratories, Albuquerque, NM 87185–0609
A. J. Hurd
Affiliation:
Ceramic Processing Science Department, Sandia National Laboratories, Albuquerque, NM 87185–0609
C. J. Brinker
Affiliation:
Ceramic Processing Science Department, Sandia National Laboratories, Albuquerque, NM 87185–0609Department 9225, Sandia National Laboratories, Albuquerque, NM 87185–1111, UNMNSF Center for Micro engineered Ceramics, University of New Mexico, Albuquerque, NM 8713
L. J. Douglas Frink
Affiliation:
Ceramic Processing Science Department, Sandia National Laboratories, Albuquerque, NM 87185–0609
F. Van Swol
Affiliation:
Ceramic Processing Science Department, Sandia National Laboratories, Albuquerque, NM 87185–0609
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Abstract

Development of capillary stress in porous xerogels, although ubiquitous, has not been systematically studied. We have used the beam bending technique to measure stress isotherms of microporous thin films prepared by a sol-gel route. The thin films were prepared on deformablesilicon substrates which were then placed in a vacuum system. The automated measurement was carried out by monitoring the deflection of a laser reflected off the substrate while changing the overlying relative pressure of various solvents. The magnitude of the macroscopic bending stress was found to reach a value of 180 MPa at a relative pressure of methanol, P/Po = 0.001. The observed stress is determined by the pore size distribution and is an order of magnitude smaller in mesoporous thin films. Density Functional Theory (DFT) indicates that for the microporous materials, the stress at saturation is compressive and drops as the relative pressure is reduced.

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