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Correlating CVD Process Parameters and Film Properties

Published online by Cambridge University Press:  21 February 2011

D. K. Chow
D. K. Chow*
Affiliation:
Consultant, 121 Fieldpoint Drive, Irvington, NY 10533
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Abstract

This paper addresses an approach of predicting the effects of deposition process parameters on the film properties. The film resistivity is shown to correlate with other properties and testing conditions in explicit group form, and so is the rate of deposition with process parameters. Through a physical property relationship the two correlations merge to permit the prediction. Justifications for the correlations derive from both experimental and theoretical work already reported. Discussions on relative sensitivities of the variables toward another will follow.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 187: Symposium J – Thin Film Structures and Phase Stability , 1990, 203
Copyright
Copyright © Materials Research Society 1990

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