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Correlation of Stress and Phase Evolution in Thin Ta Films On Si (100) During Thermal Testing

Published online by Cambridge University Press:  11 February 2011

B. L. French and
J. C. Bilello
B. L. French
Affiliation:
Center for Nanomaterials Science, Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109–2136.
J. C. Bilello
Affiliation:
Center for Nanomaterials Science, Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109–2136.
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Abstract

In this study the stress and morphology of Ta coatings sputtered on Si (100) substrates were monitored in situ and in real-time during thermal testing to allow interruptions at critical events in the coatings' stress evolution. These observations were carried out using white beam Laue transmission diffraction topography/radiography and a high-temperature sample stage at the Stanford Synchrotron Radiation Laboratory (SSRL). The structure of specimens from interrupted thermal tests was then analyzed using x-ray diffraction θ-2θ scans. The structure and phases present in the film at different stages of the thermal test were correlated with specific mechanical responses in the coating such as stress generation. This information was employed to elucidate the role of phase evolution in the respective stress responses of films deposited in high and low-pressure regimes.

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