Hostname: page-component-7b7567c8c-kwt9d Total loading time: 0 Render date: 2026-11-13T23:30:09.456Z Has data issue: false hasContentIssue false
  • English
  • Français

The Diffusion Bonding Interface Structure of Yttria Stabilized Zirconia

Published online by Cambridge University Press:  15 February 2011

Young J. Kim,
Young Sung Yoo and
Hwan Kim
Young J. Kim
Affiliation:
Sunmoon University, Department of Materials Science and Engineering, Asan, Chungnam 337 - 840, Korea
Young Sung Yoo
Affiliation:
Seoul National University, Department of Inorganic Materials Engineering, Seoul, 151, Korea
Hwan Kim
Affiliation:
Seoul National University, Department of Inorganic Materials Engineering, Seoul, 151, Korea
Get access

Abstract

The specimens of Yttria Stabilized Zirconia(3Y-TZP) were bonded by a diffusion process. The microstructural evolution at the bonded interfaces was examined for the bonding conditions. We confirmed that above general sintering temperature(1500 °C), grain coarsening, which enhances the size fluctuation at the bonding interface, not only eliminates free surfaces but also is the main mechanism of bonding. In order to enhance the diffusion rate at the bonding interface, Ceria was added as a dopant, and grain boundary undulation was examined. We found that the bonding characteristics were improved by the Ceria doping. Specimens with an undulating bonded interface exhibited transgranular fracture, while specimens with a straight interface showed intergranular fracture. The undulation at the bonded interface is suggested to improve ceramic to ceramic bonding.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1. Duh, Jenq-Gong, Dai, Hsing-Tao, and Chiou, Bi-Shiou, J. Am. Ceram. Soc., 71[10] 813 (1988).Google Scholar
2. Heussner, Karl-Heinz and Claussen, Nils, J. Am. Ceram. Soc., 72[6] 1044 (1989).Google Scholar
3. Schmid, Herbert K., J. Am. Ceram. Soc., 74[2] 387 (1991).Google Scholar
4. Ando, K., Morita, S., and Watanab, R., Yogyo-Kyokaishi, 94[8] 732 (1986).Google Scholar
5. Kim, Jeong-Joo and Kim, Doh-Yeon, J. Am. Ceram. Soc., 71[5] c–228 (1988).Google Scholar
6. Koul, A. K. and Thamburaj, R., Metall. Trans.A, 16[1] 17 (1986).Google Scholar
7. Koul, A. K. and Gessinger, G. H., Acta Metall., 31[7] 1061 (1983).Google Scholar