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Diffusive Creep in Polycrystals

Published online by Cambridge University Press:  15 February 2011

David B. Laks,
Dimitrios Maroudas,
Sokrates T. Pantelides and
IBM Thomas J. Watson
David B. Laks
Affiliation:
Research Center, Yorktown Heights, NY 10598
Dimitrios Maroudas
Affiliation:
Research Center, Yorktown Heights, NY 10598
Sokrates T. Pantelides
Affiliation:
Research Center, Yorktown Heights, NY 10598
IBM Thomas J. Watson
Affiliation:
Research Center, Yorktown Heights, NY 10598
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Abstract

We report quantitative mesoscopic calculations of diffusive creep in polycrystals under external stress. The analysis includes mass transport both in the grains and along the grain boundaries, fully coupled with elastic deformations in the grains and the evolution of the displacement field. We find that the net creep rate depends strongly on the details of grain boundary arrangements. The calculations represent a first step toward a comprehensive first-principles theory of plasticity.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 317: Symposium B – Mechanisms of Thin Film Evolution , 1993, 449
Copyright
Copyright © Materials Research Society 1994

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References

[1] Nabarro, F. R. N., in Report of a Conference on the Strength of Solids (Physical Society, London, 1948), p. 75.Google Scholar
[2] Herring, C., J. Appl. Phys. 21, 437 (1950).Google Scholar
[3] Coble, R. L., J. Appl. Phys. 34, 1679 (1963).Google Scholar
[4] Diffusional Creep of Polycrystalline Materials, edited by Burton, B. (Trans Tech Publications, Bay Village, OH, 1977).Google Scholar
[5] Hazzeldine, P. M. and Schneibel, J. H., Acta Metall. Mater. 41, 1253 (1993).CrossRefGoogle Scholar
[6] Pantelides, S. T., in Materials Reliability in Microelectronics III, Vol. 309 of Mat. Res. Soc. Symp. Proc. (M.R.S., Pittsburgh, 1993), p. 327.Google Scholar
[7] Landau, L. D. and Lifshitz, E. M., Theory of Elasticity, 3rd ed. (Pergamon, Oxford, 1986).Google Scholar
[8] Burnett, D. S., Finite Element Analysis (Addison-Wesley, Reading, MA, 1987).Google Scholar