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Electrofluidic Assembly of Nanoelectromechanical Systems

Published online by Cambridge University Press:  15 March 2011

Stephane Evoy,
Ben Hailer,
Martin Duemling,
Benjamin R. Martin,
Thomas E. Mallouk,
Irena Kratochvilova and
Theresa S. Mayer
Stephane Evoy
Affiliation:
Now at the University of Pennsylvania:, evoy@ee.upenn.edu
Ben Hailer
Affiliation:
Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA 24061
Martin Duemling
Affiliation:
Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA 24061
Benjamin R. Martin
Affiliation:
Department of Chemistry and Department of Electrical Engineering, Penn State University, University Park, PA 16802
Thomas E. Mallouk
Affiliation:
Department of Chemistry and Department of Electrical Engineering, Penn State University, University Park, PA 16802
Irena Kratochvilova
Affiliation:
Department of Chemistry and Department of Electrical Engineering, Penn State University, University Park, PA 16802
Theresa S. Mayer
Affiliation:
Department of Chemistry and Department of Electrical Engineering, Penn State University, University Park, PA 16802
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Abstract

Recent advances in surface nanomachining have allowed the fabrication of mechanical structures with dimensions reaching 20 nm, and resonant frequencies in the 100s of MHz. Structural issues prevent the “top-down” surface machining of high-quality NEMS resonators. Such systems are alternatively to be bestowed by “bottom-up” manufacturing technologies. We report the surface assembly of RF-range NEMS. Using electrofluidic assembly, we have successfully positioned Rh mechanical beams onto specific sites of a silicon circuit. With diameters as small as 250 nm and lengths varying from 2 to 3 [.proportional]m, preliminary results show mechanical resonances ranging from 5 MHz to 80 MHz, and quality factors reaching 500. We also report the development of nanostructured NEMS for sensor applications, and present strategies for their deployment in integrative nanosystems.

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