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Engineered Solder-Directed Self-Assembly Across Length Scales

Published online by Cambridge University Press:  01 February 2011

Robert Knuesel,
Shameek Bose,
Wei Zheng and
Heiko O Jacobs
Robert Knuesel
Affiliation:
knue0010@umn.edu, University of Minnesota, Department of Electrical and Computer Engineering, 200 Union Street SE, Minneapolis MN 55455, United States
Shameek Bose
Affiliation:
hjacobs@umn.edu, University of Minnesota, Electrical and Computer Engineering, 200 Union St. SE, Minneapolis, MN, 55455, United States
Wei Zheng
Affiliation:
shameek@umn.edu, University of Minnesota, Department of Electrical and Computer Engineering, 200 Union Street SE, Minneapolis, MN, 55455, United States
Heiko O Jacobs
Affiliation:
zhen0044@umn.edu, University of Minnesota, Department of Electrical and Computer Engineering, 200 Union Street SE, Minneapolis, MN, 55455, United States
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Abstract

We report on recent progress in the directed self-assembly of discrete inorganic semiconductor device components. Different from prior research, the goal is to enable the integration of increasingly small dies while supporting unique-angle orientation and contact pad registration. The process is based on the reduction of surface free energy between liquid solder coated areas on the substrate and metal-coated binding sites on the semiconductor dies. Recent advances include flip-chip assembly with unique angular orientation accomplished using “two-element” docking sites that contain pedestals that act as chaperones for the solder directed assembly to take place. The scale reduction to 20 μm sized components involves the use of a liquid-liquid interface to concentrate component delivery and speed up the self-assembly process to prevent oxidative dissolution of the solder sites prior to completion.

Keywords

self-assemblypackagingmicrostructure

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References

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