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Fluorinated, Low Thermal Expansion Coefficient Polyimides For Interlayer Dielectric Application: Thermal Stability, Refractive Index And High Temperature Modulus Measurements

Published online by Cambridge University Press:  15 February 2011

Brian C. Auman
Brian C. Auman*
Affiliation:
DuPont Electronic Materials, Experimental Station, E334/27, Wilmington, DE 19880
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Abstract

The mechanical, thermal, electrical and moisture absorption properties of rod-like, fluorinated polyimides and copolyimides developed in our laboratory are briefly reviewed. Further characterization work on the most promising candidates for interlayer dielectric applications is reported. This includes in- and out-of-plane refractive index measurements to estimate the isotropy of the dielectric constant, isothermal TGA measurements to assess thermal stability at processing temperatures and dynamic-mechanical analysis to ascertain the glass transition temperature and the mechanical modulus at temperatures in excess of the glass transition

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References

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