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High Resolution Copper Lines by direct Imprinting

Published online by Cambridge University Press:  10 February 2011

C.M. Hong,
X. Sun,
S. Wagner and
S.Y. Chou
C.M. Hong
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
X. Sun
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
S. Wagner
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
S.Y. Chou
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544
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Abstract

One-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼8 μωcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution

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References

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