Hostname: page-component-7b7567c8c-7pwfn Total loading time: 0 Render date: 2026-11-14T21:19:39.066Z Has data issue: false hasContentIssue false
  • English
  • Français

Laser Surface Modification for Copper Deposition on Polyimide

Published online by Cambridge University Press:  25 February 2011

Y.S. Liu and
H.S. Cole
Y.S. Liu
Affiliation:
GE Research and Development Center P.O. Box 8, Schenectady, New York 12345
H.S. Cole
Affiliation:
GE Research and Development Center P.O. Box 8, Schenectady, New York 12345
Get access

Abstract

Selective modification of surface reactivities with lasers, using either direct writing or projection method, is intrinsically a sensitive method to prepare a surface for highresolution and high-speed area selective thin film deposition. In this paper, we demonstrated the use of laser direct-writing and projection patterning techniques for selective modification of the electrochemical property of a polyimide surface. High quality and highresolution copper patterns on polyimide surfaces are produced when the surface-modified sample is subsequently placed in an electroless plating solution. These results demonstrated that the use of laser-selective-modification of surface properties in conjunction with other batch thin film deposition processes provides an attractive approach for area-selective metallization for a variety of applications in which high writing speed and high sensitivity are required.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1. Smart, D. V. and Stewart, D. M., Proc. of SPIE, Conf. on Lasers in Microlithography, Santa Clara, CA, 774, (1987), p. 88.Google Scholar
2. Laser Microfabrication and Thin Film Processing, edited by Ehrlich, D. J. and Tsao, J. Y., (Academic Press, to be published, 1989).Google Scholar
3. Cole, H. S., Liu, Y. S., Rose, J. W., Guida, R., Levinson, L M. and Philipp, H. R., Electrochem. Soc. Conf. on Laser Processing for Microelectronic Applications, Honolulu, Hawaii, (1987).Google Scholar
4. Liu, Y. S., in Tungsten and Other Refactory Metals Deposition for VLSI Applications, edited by Blewer, R. L, (Materials Research Society, Pittsburgh, PA, 1985), p. 43.Google Scholar
5. Stuke, M., Zhang, Y. and Kuper, S., Laser and Particle Beam Chemical Processing for Microelectronics, edited by Ehrlich, D. J., Higashi, G. S., and Oprysko, M.M., (Materials Research Society, 101, Pittsburgh, PA, 1988), p. 139.Google Scholar
6. Cole, H. S., Liu, Y. S., Rose, J. W., and Guida, R., Appl. Phys. Lett., (21), 2111 (1988).Google Scholar
7. Gross, M.E., Fisanick, G.J., Gallager, P.K., Schnoes, K.J., and Fennell, M.D., Appl. Phys. Letts., 47(7), 669, (1985).Google Scholar
8. Phillip, H. R., Cole, H. S., Liu, Y. S., and Sitnik, T. A., Appl. Phys. Lett., 48, 192 (1986).CrossRefGoogle Scholar
9. Liu, Y. S., Grubb, W. T. and Cole, H. S., Tech. Digest of Conf on Lasers and Electro-Optics, WX–5 (7), 286 (1988).Google Scholar