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Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects

Published online by Cambridge University Press:  15 February 2011

J. Dion,
P. Borgesen,
B. Yost,
D. A. Lilienfeld and
C.-Y. Li
J. Dion
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY
P. Borgesen
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY
B. Yost
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY
D. A. Lilienfeld
Affiliation:
National Nanofabrication Facility, Cornell University, Ithaca, NY
C.-Y. Li
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY
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Abstract

An adhesive based interconnect design in which the contact force between a bumped die and substrate is maintained by the shrinkage stress of the adhesive was investigated for use in high performance applications. In general, heating will reduce the contact force because of the differential thermal expansions and load relaxation in the adhesive. Special experimental techniques have been developed to measure the relevant materials properties. The potential for optimization in terms of materials selection is discussed.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993, 27
Copyright
Copyright © Materials Research Society 1994

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References

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