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Micromechanics Measurements Applied to Integrated Circuit Microelectronics

Published online by Cambridge University Press:  10 February 2011

David R. Clarke
David R. Clarke*
Affiliation:
Materials Department, College of Engineering University of California, Santa Barbara, CA 91360–5050 clarke@engineering.ucsb.edu
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Abstract

As in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.

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References

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