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Microstructure and Composition of Au-Sn Eutectic Solder Electroplated from a Single Solution

Published online by Cambridge University Press:  26 February 2011

G. H. Jeong,
J. H. Kim,
Duhyun Lee and
S. J. Suh
G. H. Jeong
Affiliation:
skk94@skku.edu, Sungkyunkwan University, Dept. of Advanced materials Eng., 300, Chunchun-dong, Suwon, Kyung-Ki-do, 440-746, Korea, Republic of
J. H. Kim
Affiliation:
saw999@skku.edu
Duhyun Lee
Affiliation:
duhyun@skku.edu
S. J. Suh
Affiliation:
suhsj@skku.ac.kr
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Abstract

In this study, we produced Au-Sn alloy electroplated from a single solution and optimized the composition. The composition of electroplated Au-Sn alloy was Au-31.02 at.% Sn at the condition of 6 ms on - 4 ms off pulse current, 50 °C and 10 mA/cm2. Results in XRD analysis showed that Au-Sn alloy electroplated at DC 10 mA/cm2 had AuSn phase (δ) only and Au5Sn phase (d) appeared with decreasing the pulsed current on time. Also micro-patterned Au-Sn solder bump was produced by photolithography. Though it’s composition of Au-35.98 at.% Sn was not optimum, we tried to bond between Au-Sn solder bump and Si wafer that was coated with Ti (100 nm)/Au (300 nm).

Keywords

electrodepositionAuSn

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References

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