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Microstructure Evolution Across Interfaces of Heterogeneous Metal Systems Under Ultrasonic Impact

Published online by Cambridge University Press:  01 February 2011

Youhong Li,
Yinon Ashkenazy and
Robert S. Averback
Youhong Li
Affiliation:
Computational Science and Engineering, University of Illinois at Urbana-Champaign, 1304 W. Springfield Av. Urbana, IL 61801, USA.
Yinon Ashkenazy
Affiliation:
Racah Institute of Physics, Hebrew University of Jerusalem, Israel.
Robert S. Averback
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 W. Green St. Urbana, IL 61801, USA.
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Abstract

Large-scale Molecular Dynamics (MD) studies on heterogeneous, model metal systems subjected to intense shock loading by a flyer plate were carried out. Of interest here is the effect of structural defects on interfacial strength under these extreme conditions. The metal target and flyer were essentially single crystals of Cu, but an interface layer was created by varying the mass of the Cu atoms in part of the sample. Interfacial defects in the form of vacancies, and at different concentrations, were introduced into the interfacial region. In addition to microstructural evolution of damage in this system, the shock induced temperature and pressure changes were also analyzed.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 854: Symposium U – Stability of Thin Films and Nanostructures , 2004, U11.2
Copyright
Copyright © Materials Research Society 2005

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