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Novel Technique to Improve Adhesion Between Metal‐Polymer Interfaces

Published online by Cambridge University Press:  10 February 2011

Marlon Menezes,
I.M. Robertson and
H.K. Birnbaum
Marlon Menezes
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, 1304 W. Green St., Urbana Illinois. 61801
I.M. Robertson
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, 1304 W. Green St., Urbana Illinois. 61801
H.K. Birnbaum
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, 1304 W. Green St., Urbana Illinois. 61801
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Abstract

Partially embedded copper clusters within a polyimide substrate have been utilized to act as “nano‐nails” to anchor the bulk metal overlayer to the underlying polyimide substrate resulting in increased adhesion between the metal and substrate. Isolated nano‐sized copper clusters can be formed on a polyimide surface under UHV conditions using very slow deposition rates and temperatures that are high enough to induce mobility of copper atoms on the polyimide surface. Because copper has a high surface energy with respect to the copper/polyimide interface and the polymer surface, the copper clusters exert an embedding force on the polyimide substrate. These clusters can be made to embed in the polymer by annealing in vacuum at temperatures close to the glass transition temperature of the polymer. By regulating the time and temperature of post‐deposition anneals, the degree of embedding of the copper clusters can be controlled. Cross‐sectional TEM results will illustrate the various degrees of cluster embedding, while adhesion testing results will be presented to show the improved adhesion obtained from these interfaces.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996, 269
Copyright
Copyright © Materials Research Society 1997

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