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Phase Equilibria in Complex Solder Systems

Published online by Cambridge University Press:  25 February 2011

M. R. Notis,
S. K. Tarby and
T. Cawley
M. R. Notis
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, PA 18015
S. K. Tarby
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, PA 18015
T. Cawley
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, PA 18015
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Abstract

Ternary solder alloys have come into wide use in chip bonding, printed circuit board connection, and in ceramic package sealing applications. Little is known concerning phase equilibria in many of these systems. Methods for predicting phase equilibria in the ternary (Pb+Sn)+Ag system using CAD (computer aided design) are described, and a predicted value for the ternary eutectic temperature is compared with values obtained by differential scanning calorimetry (DSC) for this system.

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References

1. Manko, H.H., Solders and Soldering (McGraw-Hill Book Co. New York, NY, 1984), p. 122.Google Scholar
2. Roeder, J.F. and Notis, M.R., “Electron Microprobe Determination of Phase Equilibria in the Cu-As-Sn System” in Microbeam Analysis-1985, edited by Armstrong, J.T. (San Francisco Press, CA 1985), p. 170–172.Google Scholar
3. Roeder, J.F., Notis, M.R. and Tarby, S.K., “CAD Representation of Phase Diagrams and Experimental Phase Equilibria Determination in the Cu-As-Sn System” to be published in Computer Modeling of Phase Diagrams, Bennett, L. E., ed., AIME (1986).Google Scholar
4. Notis, M.R. and Tarby, S.K., “Educational Packages for Ternary Phase Equilibria Using High Resolution CAD Color Computer Graphic Display” to be published in Computer Modeling of Phase Diagrams, Bennett, L. E., ed., AIME (1986).Google Scholar
5. Christian, H.N. and Stephenson, M.B., “MOVIE BYU--A General Purpose Computer Graphics Display System” in Proc. Symp. on Applications of Computer Methods in Engineering, Vol.2, (U.So.Cal.-L.A., 1977), p. 759–769.Google Scholar
6. deBoor, C., A Practical Guide to Splines (Springer-Verlag, New York, NY, 1978).CrossRefGoogle Scholar
7. Hansen, M. and Anderko, K., Constitution of Binary Alloys (McGraw-Hill, Inc., New York, NY 1958).CrossRefGoogle Scholar
8. Elliot, R.P., Constitution of Binary Alloys--First Supplement (McGraw-Hill, Inc., New York, NY 1965).Google Scholar
9. Earle, L.G., J. Inst. Metals, 1946, vol.72, pp. 403–413.Google Scholar
10. Tarby, S.K. and Notis, M.R., “Effect of Small Additions of Silver on the Eutectic Temperature in the Lead-Tin System,” accepted for publication in Metall.Trans.(B)Google Scholar
11. Lupis, C.H.P., Meta I. Trans. B, 1978, vol.9B, pp. 231–239.CrossRefGoogle Scholar
12. Lupis, C.H.P., Chemical Thermodynamics of Materials, Elsevier Science Publishing Co., New York, NY, 1983, pp. 315–324.Google Scholar