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Polymer/Metal Interconnection Systems for Microelectronics Packaging

Published online by Cambridge University Press:  15 February 2011

Ho-Ming Tong
Ho-Ming Tong*
Affiliation:
IBM East Fishkill Facility Hopewell Junction, New York 12533
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Abstract

This article provides an overview on polymer/metal interconnection systems for microelectronics packaging. It will begin with a description of the functions of interconnection, and types of polymer/metal interconnection techniques available with tape automated bonding (TAB) being the most popular for chip connection applications. This is followed by examples of worldwide TAB applications and market outlook, TAB tape offerings and trends, as well as the entire TAB technology including tape types and fabrication, substrates interconnected by TAB, bonding techniques, TAB mounting options and TAB package encapsulation. Finally, future challenges on the most demanding fine-pitch TAB technology will be discussed.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 51
Copyright
Copyright © Materials Research Society 1992

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References

1. Tummala, R. R. and Rymaszewski, E. J., Microelectronics Packaging Handbook, (Van Nostrand Reinhold, New York, 1989), p. 1442.Google Scholar
2. Rymaszewski, E. J. and Tummala, R. R., Microelectronics Packaging - An Overview, in Microelectronics Packaging Handbook, edited by Tummala, R. R., and Rymaszewski, E. J. (Van Nostrand Reinhold, New York, 1989), pp. 1–64.Google Scholar
3. Lau, J. H., Erasmus, S. J. and Rice, D. W., Circuit World, 16(2), 5–24 (1990).Google Scholar
4. Tuck, J., Circuits Assembly, April 1992. pp. 22–23.Google Scholar
5. Markstein, H., TAB Excels in Fine-Pitch Applications, Electronic Packaging & Production, September 1990, 32–36.Google Scholar
6. Khadpe, S., Developments in Tape Automated Bonding, Electronic Packaging & Production, November 1991, 42–45.Google Scholar
7. Gilleo, K., Expanding the Capacity of Flexible Circuitry, Electronic Manufacturing, September 1990, 18–21.Google Scholar
8. Markstein, H. W., Connectors for High Speed Signals, Electronic Packaging and Production, September 1991, 44–50.Google Scholar
9. Markstein, H. W., Applications for Flex Circuits, Electronic Packaging and Production, February 1992, 41–45.Google Scholar
10. Koopman, N. G., Reiley, T. C. and Totta, P. A., Chip-to-Package Interconnections, in Microelectronics Packaging Handbook, edited by Tummala, R. R., and Rymaszewski, E. J. (Van Nostrand Reinhold, New York, 1989), pp. 361–453.Google Scholar
11. Rymaszewski, E. J., Walsh, J. L. and Leehan, G. W., Semiconductor Logic Technology in IBM, IBM J. Res. Develop., 25( 9), 603–616 (September 1981).Google Scholar
12. Eastman, O., Future Packaging Directions in the 1990's and Their Materials Challenges, in Advanced Electronic Packaging Materials, edited by Barfknecht, A. T., Partridge, J. P., Chen, C. J. and C. Y. Li (Mater. Res. Soc. Proc. 167. Pittsburgh, PA 1990), p. 3.Google Scholar
13. Pound, R., Today's Technology Foretells the Future, Electronic Packaging & Production, July 1988, 24–29.Google Scholar
14. Tong, H. (unpublished data)Google Scholar
15. Doss, K., Proc., NEPCON West, 1990, 944.Google Scholar
16. Gurley, S., Flexible Circuits: Design and Applications (Marcel Dekker, Inc., New York 1984).Google Scholar
17. Kawanobe, T., Miyamoto, K., and Hirano, M., Tape Automated Bonding Process for High Lead Count LSI, 33rd Electronic Comp. Conf. Proc., May 1983, 221–226.Google Scholar
18. Smith, J. M. and Stuhlbarg, S. M., Hybrid Microcircuit Tape Chip Carrier Materials/Processing Trade-Offs', IEEE Trans. Parts Hybrids Packag., PHP-13 (3), 257–268 (September 1977).Google Scholar
19. Rima, P. W., Connection Technology, August 1987, 29.Google Scholar
20. Hommond, R., Laser Energy for Single-point Tape Automated Bonding and Solder Reflow, Third International TAB Symp. Proc., February 1991, 131–145.Google Scholar
21. Wolfe, G., Electronic Packaging Issues in the 1990's, Electronic Packaging –80.Google Scholar
22. Weiler, P., Proc. NEPCON West, 1989, 482.Google Scholar
23. Fujita, K., Onishi, T., Wakomoto, S., Maeda, T. and Hayakawa, M., Chip-Size Plastic Encapsulation on Tape Carrier Package, Int. J. for Hybrid Microelectronics, (8), 9–15 (1985).Google Scholar
24. Quach, A. and Hunter, W. L., A Study of Properties of Plastics Used for Semiconductor Encapsulation, J. Electronic Materials, 1977. 319–331.Google Scholar
25. Wong, C. P., Thermogravimetric Analysis of Silicone Elastomers as Integrated Circuit Device Encapsulants, in Polymers in Electronics, ed. by Davidson, T. (Am. Chem. Soc., Washington, D. C. 1984), pp. 285–304.CrossRefGoogle Scholar
26. Tape Automated Bonding Engineering/Reliability Study, Mesa Technology, Olin Interconnect Technologies Co. (May 1987).Google Scholar
27. Messner, G. and Lassen, C., Substrates for Surface Mounted Components, Proc. the Printed Circuit World Convention II, 1 415–427 (1981).Google Scholar