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Preparation of Cross Sectional TEM Samples Using Lithographic Techniques and Reactive Ion Etching

Published online by Cambridge University Press:  16 February 2011

Jeffrey T. Wetzel and
K. L. Kavanagh
Jeffrey T. Wetzel
Affiliation:
IBM Research Division, T.J. Watson Research Center, Box 218, Yorktown Heights, N.Y. 10598Advanced Products Research and Development Laboratory, Motorola, Inc, 3501 Ed Bluestein Blvd., Austin, TX, 78721
K. L. Kavanagh
Affiliation:
IBM Research Division, T.J. Watson Research Center, Box 218, Yorktown Heights, N.Y. 10598Department of Electrical and Computer Engineering, UCSD, San Diego, CA 92093
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Abstract

This paper summarizes methods used to create cross-sectional samples for transmission electron microscopy and introduces another variant of the technique all of which rely upon some combination of lithographic patterning and reactive ion etching. The basic idea pursued in using these techniques was to form, from a preselected location, samples that had a large transparent area without use of mechanical polishing or ion milling. Samples were successfully prepared in this manner, but room for improvement remains due to the limited range of diffraction conditions available for imaging or diffraction pattern formation.

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References

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