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Reaction Diffusion in the Au-Cu-Pb-Sn System at Low Temperature

Published online by Cambridge University Press:  21 February 2011

J. F. Roeder,
M. R. Notis and
J. I. Goldstein
J. F. Roeder
Affiliation:
Dept. of Materials Science and Engineering Lehigh University, Bethlehem, PA 18015
M. R. Notis
Affiliation:
Dept. of Materials Science and Engineering Lehigh University, Bethlehem, PA 18015
J. I. Goldstein
Affiliation:
Dept. of Materials Science and Engineering Lehigh University, Bethlehem, PA 18015
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Abstract

The microstructure of a Cu3Au v. Pb-5wt%Sn diffusion couple was examined in the as-dipped and annealed conditions. The as-dipped couple showed no reaction between the solder and the base metal. The couple developed intermediate layers of two intermetallic phases upon annealing for 289 hours at 169°C. These phases were identified as phi and eta’ which are contained in the Au-Cu-Sn ternary system. No phases containing significant amounts of Pb formed, indicating that even at low concentrations in a Pb-Sn solder, Sn is the active chemical specie in the solder for the Au-Cu-Pb-Sn system. The microhardness of the eta’ phase was found to be equal to that of Cu3Sn, which forms in the absence of Au in the Cu base metal. However, the the phi phase was harder, and therefore the presence of Au in the base metal may adversely affect the thermal fatigue resistance of the solder joint.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987, 391
Copyright
Copyright © Materials Research Society 1988

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References

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