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Simulation of Collimated Titanium Nitride Physical Vapor Deposition using EVOLVE

Published online by Cambridge University Press:  25 February 2011

Anthony J. Toprac,
Shi-Qing Wang,
Jim Schlueter and
Timothy S. Cale
Anthony J. Toprac
Affiliation:
SEMATECH, 2706 Montopolis, Austin, TX 78741-6499
Shi-Qing Wang
Affiliation:
SEMATECH, 2706 Montopolis, Austin, TX 78741-6499Also with Fairchild Research Center, NSC
Jim Schlueter
Affiliation:
SEMATECH, 2706 Montopolis, Austin, TX 78741-6499
Timothy S. Cale
Affiliation:
Arizona State University, Tempe, AZ 85287-6006
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Abstract

Simulation of the physical vapor deposition (PVD) of titanium nitride (TiN) in micronscale contacts was performed using EVOLVE, a physically-based model of non-continuummass transport. Simulations of uncollimated TiN PVD using a sub-unity sticking coefficient of 0.6 provide accurate model predictions of experimental data. Using this value in simulations of PVD with a 1:1 aspect ratio collimator results in a significant underprediction of titanium nitride deposition in the feature bottom in comparison to the experimental results. This under-prediction was compensated for empirically by adjustinga “beaming” coefficient to produce good model predictions of the experimental data.

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References

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