Hostname: page-component-7b7567c8c-kwt9d Total loading time: 0 Render date: 2026-11-14T04:48:14.707Z Has data issue: false hasContentIssue false
  • English
  • Français

Stress Evolution during Thermoset Cure

Published online by Cambridge University Press:  10 February 2011

Yuhai Mei,
Albert F. Yee,
Alan S. Wineman and
Chaodong Xia
Yuhai Mei
Affiliation:
Department of Mechanical Engineering and Applied Mechanics, The University of Michigan, 2250 G.G. Brown, 2350 Hayward St., Ann Arbor, MI 48109-2125
Albert F. Yee
Affiliation:
Department of Materials Science and Engineering, The University of Michigan, Ann Arbor, MI 48109-2136
Alan S. Wineman
Affiliation:
Department of Mechanical Engineering and Applied Mechanics, The University of Michigan, 2250 G.G. Brown, 2350 Hayward St., Ann Arbor, MI 48109-2125
Chaodong Xia
Affiliation:
National Starch and Chemical Company, 10 Finderne Ave., Bridgewater, NJ 08807
Get access

Abstract

The residual stress evolution in an epoxy during isothermal curing process has been determined experimentally. It was found that for a certain curing temperature range in which the characteristic time for the molecular motions leading to volume recovery is shorter than the time scale of the experiment, an incremental elastic constitutive equation can be used to describe the mechanical response of the epoxy. It was also found that appreciable residual stresses are developed in a threedimensionally constrained epoxy resin system within the rubbery state.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998, 195
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

[1] Hohn Enns, B. and Gillham, Jhon K., “Time-Temperature-Transformation (TTT) Cure Diagram: Modeling the Cure Behavior of Thermosets,” Journal of Applied Polymer Science, Vol.28, pp.2567–2591, 1983.Google Scholar
[2] Plepys, A.R. and Farris, R.J., “Evolution of Residual Stresses in Three-Dimensionally Constrained Epoxy Resins,” Journal of Polymer, Vol.31, pp. 1932–1936, October, 1990.Google Scholar
[3] Wineman, Alan S., “An Introduction to the Mechanical Response of Polymers,” Cambridge University Press, to be published.Google Scholar
[4] Flory, P.J., “Principles of Polymer Chemistry,” Cornell University Press, Ithaca, NY 1979.Google Scholar
[5] Mei, Yuhai, Wineman, Alan S., Yee, Albert F. and Xiao, C.D.,“Pre-extended Balloon Method for Measuring the Volume Shrinkage During Thermoset Curing Process,” (The University of Michigan report), 1998.Google Scholar
[6] Mei, Yuhai, Wineman, Alan S., Yee, Albert F. and Xiao, C.D.,“Volume Shrinkage During Thermoset Curing Process,” (The University of Michigan report), 1998.Google Scholar