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Texture and Microstructure Effects on Electromigration Behavior of Aluminum Metallization

Published online by Cambridge University Press:  15 February 2011

D. B. Knorr,
K. P. Rodbell and
D. P. Tracy
D. B. Knorr
Affiliation:
Materials Engineering Department, Rensselaer Polytechnic Institute, Troy, New York 12180-3590
K. P. Rodbell
Affiliation:
IBM T.J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 10598
D. P. Tracy
Affiliation:
Materials Engineering Department, Rensselaer Polytechnic Institute, Troy, New York 12180-3590
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Abstract

Pure aluminum films are deposited under a variety of conditions to vary the crystallographic texture. After patterning and annealing at 400°C for 1 hour, electromigration tests are performed at several temperatures. Failure data are compared on the basis of t50 and standard deviation. Microstructure is quantified by transmission electron microscopy for grain size and grain size distribution and by X-ray diffraction for texture. A strong (111) texture significantly improves the electromigration lifetime and decreases the standard deviation in time to failure. This improvement correlates with both the fraction and sharpness of the (111) texture component.

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References

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