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Texture Evolution in Cu Films and Lines

Published online by Cambridge University Press:  01 February 2011

Chia-Jeng Chung,
David Field,
No-Jin Park and
Christy Woo
Chia-Jeng Chung
Affiliation:
cchung1@wsu.edu, Washington State University, Materials Science and Engineering, Pullman WA 99163, United States
David Field
Affiliation:
dfield@wsu.edu, WSU, MSE, Spokane Street, Pullman, WA, 99163, United States
No-Jin Park
Affiliation:
njpark@kumoh.ac.kr, Kumoh Institute of Technology, Gumi City, N/A, Korea, Democratic People's Republic of
Christy Woo
Affiliation:
christy.woo@spansion.com, Advanced Micro Devices, Sunnyvale, 94086, United Kingdom
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Abstract

Grain growth in polycrystalline films is controlled by the energetics of the surface, interface and grain boundaries as well as strain energy. The unique character of damascene lines fabricated from electroplated Cu films introduces the additional considerations of bath chemistry and geometric constraints. The moderate stacking fault energy of Cu allows for the development of a substantial twin fraction for certain growth conditions. This paper discusses in-situ observation of grain growth in Cu films and lines under various processing conditions. It is shown that for thicker films and for structures constrained within damascene trenches the energetics of twin boundary formation play a large role in texture development of these structures.

Keywords

Cumicrostructurethin film

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References

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