Hostname: page-component-7b7567c8c-wxvwp Total loading time: 0 Render date: 2026-11-14T03:47:51.958Z Has data issue: false hasContentIssue false
  • English
  • Français

Time Dependent Indentation Testing At Non-Ambient Temperatures Utilizing the High Temperature Mechanical Properties Microprobe

Published online by Cambridge University Press:  21 February 2011

B. N. Lucas and
W. C. Oliver
B. N. Lucas
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN and The University of Tennessee, Knoxville
W. C. Oliver
Affiliation:
Nano Instruments, Inc., PO. Box 14211, Knoxville, TN 37914
Get access

Abstract

Time dependent indentation data for pure indium from -100 °C to 75 °C is presented. The properties reported include hardness, indentation strain rate, stress exponent and apparent activation energy for creep. These properties were measured using a depth-sensing indentation system capable of performing experiments between -100 °C and 300 °C in ultra-high vacuum. In addition, by employing laser interferometric techniques, this system can obtain displacement data with time constants as low as 50 ns. This allows the investigation of the material response to very fast stress changes over an extremely wide range of strain rates. The adverse and beneficial dynamic effects of step-loading the indenter into the surface of the material will be discussed. Initial results obtained from this type of experiment show that it is possible to obtain energy dissipation or damping information from the material being studied.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1. Oliver, W. C. and Pharr, G. M., J. Mater. Res., 7,1564, (1992).Google Scholar
2. Doerner, M. F. and Nix, W. D., J. Mater. Res., 1, 601, (1986).Google Scholar
3. Mayo, M. J. and Nix, W. D.. Acta Met., 6, 2183, (1988).Google Scholar
4. Raman, V. and Berriche, R., J. Mater. Res. 7, 627 (1992).Google Scholar
5. Lucas, B.N. and Oliver, W.C. in Thin Films: Stresses and Mechanical Properties III, edited by Nix, W.D., Bravman, J.C., Arzt, E., and Freund, L.B. (Mater. Res. Soc. Symp. Proc. 239, Pittsburgh, PA, 1992), p. 337.Google Scholar
6. Tabor, D. S., The Hardness of Metals, (Oxford, Clarendon Press, 1951), 105.Google Scholar
7. Poisl, W. H., Oliver, W. C. and Fabes, B. D., in preparation for J Maters. Res.Google Scholar
8. Eckert, R. E. and Drickamer, H. G., J. Chem. Phys., 20,13, (1952).Google Scholar
9. Powell, G. W. and Braun, J. D., Trans. AIME, 230, 694, (1960).Google Scholar
10. Sherby, O. D. and Miller, A. K., Trans. ASME, J. Engr. Mat. Tech., 101, 387, (1979).Google Scholar
11. Sherby, O. D., Acta Met., 10,135, (1962).Google Scholar
12. Sherby, O. D. and Armstrong, P. E., Met. Trans., 2, 3479, (1971).Google Scholar
13. Roebuck, B. and Almond, E. A., J of Mater. Sci. Letters, 1, 519, (1982).Google Scholar
14. Chu, S. N. G. and Li, J. C. M., J of Mater. Sci., 12,2200, (1977).Google Scholar