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Adhesion and Subcritical Debonding of Polymer Interfaces for Microelectronic Packaging

Published online by Cambridge University Press:  10 February 2011

J. M. Snodgrass,
G. Hotchkiss and
R. H. Dauskardt
J. M. Snodgrass
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
G. Hotchkiss
Affiliation:
DSPS Packaging Development, Texas Instruments Inc., Dallas, TX 75265
R. H. Dauskardt
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
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Abstract

Techniques are discussed for evaluating both critical interface adhesion values as well as the sub-critical debond behavior of polymer/silicon and polymer/polymer interfaces. Sub-critical debonding behavior is expected to be most relevant in predicting the in-service lifetime of microelectronic packages. Our research characterizes the debonding of a benzocyclobutene overlayer, as well as a technologically relevant epoxy underfill/polyimide/silicon interface system. Adhesion values are measured in a double cantilevered beam (DCB) and four-point bend fracture mechanics geometries by driving a stable debond along the relevant interfaces. The effect of temperature on subcritical debonding in an underfill/polyimide interface is described. Issues of crack path selection involving the selection of microstructurally weak paths in the layered system are considered.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998, 37
Copyright
Copyright © Materials Research Society 1998

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References

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