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Adhesion Study in Aluminum/Polyimide System

Published online by Cambridge University Press:  10 February 2011

S. H. Yoo,
S. J. Heo,
Y.-H. Kim,
B. J. Han and
J. H. Yoon
S. H. Yoo
Affiliation:
Dept. of Materials Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-ku, Seoul, Korea
S. J. Heo
Affiliation:
Dept. of Materials Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-ku, Seoul, Korea
Y.-H. Kim
Affiliation:
Dept. of Materials Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-ku, Seoul, Korea
B. J. Han
Affiliation:
Semiconductor Inc, Seoul, Korea
J. H. Yoon
Affiliation:
Semiconductor Inc, Seoul, Korea
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Abstract

The effects of RF plasma precleaning and polyimide curing conditions on the peel strength have been studied. polyimide precursors of BG-2480 (Toray) and PI-2611 (Du Pont) were spincoated and cured under the various conditions. Cured polyimide substrates were in-situ Ar+ RF plasma cleaned prior to metal deposition. Al-2%Si or Al-0.5%Cu-1%Si thin films were deposited onto polyimide substrates using DC magnetron sputtering.

The peel strength was enhanced by RF plasma treatment. The Al/modified PI specimen failed cohesively in the polyimide. The polyimide curing condition strongly affects the peel strength in the Al/modified PI system.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 511: Symposium E – Low Dielectric Constant Materials IV , 1998, 377
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1. Culver, R., Solid State Technology, 40, 151 (1997)Google Scholar
2. Lau, J. H., Flip Chip Technologies, McGraw-Hill, New York, 1996, pp 181–201 Google Scholar
3. Ramos, M. M. D., Stoneham, A. M., and Sutton, A. P., Acta metall. Mater., 41, 2105 (1993)Google Scholar
4. Selmani, A., J. Vac. Sci. Technol. A 8(1), 123 (1990)Google Scholar
5. Chenite, A., Selmani, A., Lamontagne, B., and Yelon, A., J. Vac. Sci. Technol. A10(5), 2411 (1993)Google Scholar
6. Vasile, M. J., Bachman, B. J., J. Vac. Sci. Technol. A 7(5), 2992 (1989)Google Scholar
7. Oh, T. S., Kowalczyk, S. P., Hunt, D. J., and Kim, J., J. Adhesion Sci. Technol., 4, 119 (1990)Google Scholar
8. Chung, T. G., Kim, Y. H., and Yu, J., J. Adhesion Sci. Technol., 8, 41 (1994)Google Scholar
9. Bartha, J. W., Hahn, P.O., Legoues, F., and Ho, P. S., J. Adhesion Sci. Technol., A3, 1390 (1985)Google Scholar
10. Takahashi, N., Yoon, D. Y, and Parrish, W., Macromolecules, 17, 2583 (1984)Google Scholar
11. Cho, K. W., Lee, D. H., Lee, M. S., and Park, C. E., Polymer 38, 1615 (1997)Google Scholar
12. Jang, J. S., Lee, J. H., J. Applied Polymer Sci., 62, 199 (1996)Google Scholar