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Advanced Materials for Printed Circuit Boards

Published online by Cambridge University Press:  21 February 2011

David Wei Wang
David Wei Wang*
Affiliation:
IBM Corporation, Systems Technology Division, 1701 North Street, Endicott, New York 13760
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Extract

The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars' worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability.

Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987, 125
Copyright
Copyright © Materials Research Society 1988

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References

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