Hostname: page-component-6898cfcb55-cbk24 Total loading time: 0 Render date: 2026-11-11T21:11:39.597Z Has data issue: false hasContentIssue false
  • English
  • Français

Area Array Solder Joints for Passive Alignment

Published online by Cambridge University Press:  15 February 2011

John McGroarty,
Boris Yost,
Peter Børgesen and
Che-Yu Li
John McGroarty
Affiliation:
Department of Materials Science and Engineering Cornell University Ithaca, NY
Boris Yost
Affiliation:
Department of Materials Science and Engineering Cornell University Ithaca, NY
Peter Børgesen
Affiliation:
Department of Materials Science and Engineering Cornell University Ithaca, NY
Che-Yu Li
Affiliation:
Department of Materials Science and Engineering Cornell University Ithaca, NY
Get access

Abstract

Passive alignment techniques using area array solder joints are currently under investigation as a cost effective method of achieving electro-optical interconnects in electronic packages. Several investigators have developed models that describe the shapes of and forces produced by the liquid solder drops during reflow. These models are reviewed to provide a scientific basis for the application of such techniques.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992, 423
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1 Wale, M.J., and Edge, C., “Self-Aligned Flip-Chip Assembly of Photonic Devices with Electrical and Optical Connections”, IEEE Trans. on CHMT, vol 13, no 4, Dec 1990, p. 780–786.Google Scholar
2 Jackson, K.P., Flint, E.B., Cina, M.F., Moll, A N J. Ewen, J.F., Flagello, D., Rand, R. Purushothaman, S., “Packaging for a 1 Gb/s OEIC Fiber-Optic Data Link”, Proceedings of the Electronic Component Conference, Houston, 1989, p. 374–377.Google Scholar
3 Cohen, M.S., Cina, M.F., Bassous, E., Oprysko, M., and Speidell, J.L “Passive Laser-Fiber Alignment by Index Method”, IEEE Transactions Photonics Technology Letters, vol.3, no. 11, Nov. 1991, p. 985–987.CrossRefGoogle Scholar
4 Pfeiffer, L West, K.W., and Wong, Y.H., “Self-Aligned Controlled Collapse Chip Connect (SAC4)”, J. Electrochemical Society, Nov. 1987, p. 2940–2941.Google Scholar
5 Oprysko, M., “Optical Waveguides in the Computer Environment: A Packaging Perspective”, MRS Symposium Proceedings, vol.167, 1990, p. 61–69.Google Scholar
6 LaPlace, P.S., Theory of Capillary Attraction, 1805.Google Scholar
7 Young, T., “On the Cohesion of Fluids”, Phil Trans R Soc London A, v 95 p.68 1805.Google Scholar
8 Bashforth, F.and Adams, J.C., An Attempt to Test the Theories of Capillary Attraction, Cambridge University Press, 1883.Google Scholar
9 Padday, J.F., “Profiles of Axially Symmetric Menisci”, Phil Trans R Soc London A, v 269, p. 265–293, 1971.Google Scholar
10 Michael, D.H., “Meniscus Stability”, Ann. Rev. Fluid Mech., 13:189–215, 1981.Google Scholar
11 Concus, P. and Finn, R. “The Shape of a Pendant Liquid Drop”, Phil Trans R Soc London A, v 292, p. 307–340, 1979.Google Scholar
12 Michael, D.H. and Williams, P.G. “The Equilibrium and Stability of Axisymmetric Pendent Drops”, Proc R Soc London A, v. 351, p. 177–127, 1976.Google Scholar
13 Gillette, R.D. and Dyson, D.C. “Stability of Axisymmetric liquid-Fluid Interfaces Towards General Disturbances”, Chem Eng J, 3, p.196–199, 1972.Google Scholar
14 Gillette, R.D. and Dyson, D.C. “Stability of Fluid Interfaces of Revolution Between Equal Solid Circular Plates”, Chem Eng J, 2, p.44–54, 1971.Google Scholar
15 Surek, T and Coriell, S.R., “Shape Stability in Float Zoning of Silicon Crystals”, 433 Journal of Crystal Growth 37 (1977) p.253–271.Google Scholar
16 Coriell, S.R., Hardy, S.C., and Cordes, M.R., “Stability of Liquid Zones”, Journal of Colloid and Interface Science,. 60, #1, 1977, p.126–136.CrossRefGoogle Scholar
17 Corieli, S.R. and Cordes, M.R. ‘Theory of Molten Zone Shape and Stability”, Journal of Crystal Growth 42 (1977) p.466–472.Google Scholar
18 Boucher, E.A. and Evans, M.J.B. “Pendant Drop Profiles and Related Capillary Phenomena”, Proc R Soc London A, v 346, p.349–374, 1975.Google Scholar
19 Boucher, E.A., Evans, M.J.B., and Kent, H.J., “Capillary Phenomena. II. Equilibrium and Stability of Rotationally Symmetric Fluid Bodies”, Proc R Soc London A, v 349, p.81–100, 1976.Google Scholar
20 Russo, M.J.and Steen, P.H. “Instability of Rotund Capillary Bridges to General Disturbances: Experiment and Theory”, Journal of Colloid and Interface Science, v 113, no. 1, Sept 1986, p.154–163.Google Scholar
21 Larkin, B.K., “Numerical Solution to the Equation of Capillarity”, Journal of Colloid and Interface Science, v 23, p 305–312, 1967.Google Scholar
22 Orr, F.M.and Scriven, L E. “Menisci in Arrays of Cylinders: Numerical Simulation by Finite Elements”, Journal of Colloid and Interface Science, v 52 no 3M, p. 602–610, September 1975.Google Scholar
23 Orr, F.M., Brown, R.A., and Scriven, L E. ‘Three-Dimensional Menisci: Numerical Simulation by Finite Elements”, Journal of Colloid and Interface Science, v 60 no 1, p. 137–147, June 1977.Google Scholar
24 Miller, L F. “Controlled Collapse Reflow Joining”, IBM J. Res. Dev., vol.13, May 1969, p. 239–250.Google Scholar
25 Goldmann, L S. “Geometric Optimization of Controlled Collapse Interconnections”, IBM J. Res. Dev., vol.13, May 1969, p. 251–265.0Google Scholar
26 Heinrich, S.M., “Solder Joint Formation in Surface Mount Technology-Part I: Analysis”, Transactions of the ASME, v 112, Sept 1990, p.210–218.Google Scholar
27 Patra, S.K.and Lee, Y.C. “Quasi-Static Modeling of Self-Alignment Mechanism in Flip-Chip Soldering Process”, ASME Winter Annual Meeting, 90-WA/EEP-37, Dallas, TX, Nov 25–30, 1990.Google Scholar
28 Patra, S.K.and Lee, Y.C. “Modeling of Self-Alignment Mechanism in Flip-Chip Soldering Part II: Multiple Solder Joints”, ASME Winter Annual Meeting, 90- WA/EEP-37, Dallas, TX, Nov 25–30, 1990.Google Scholar
29 Katyl, R.H., and Pimbley, W.T., “Shape and Force Relationships for Molten Axisymmetric Solder Connections”, ASME meeting ‘Manufacturing Processes and Materials Challenges in Microelectronics Packaging’ AMD v 131, Dec. 1991, p.57–64 Google Scholar
30 Landry, M., Patra, S.K., and Lee, Y.C., “Experiment and Modeling of the Self- Alignment Mechanism in Flip-Chip Soldering”, ASME Winter Annual Meeting, 1991.Google Scholar
31 Pars, L A. An Introduction to the Calculus of Variations, John Wiley and Sons, New York, 1962.Google Scholar
32 Yost, B., McGroarty, J., Borgesen, P., and Li, C.-Y., ‘The Shape of a’ Liquid Solder Drop Constrained by Parallel Plates”, to be published.Google Scholar
33 Greenspan, D., Numerical Solutions of Nonlinear Differential Equations, J. Wiley, New York, 1966.Google Scholar