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Barrier Effect on Electroplated Cu Films

Published online by Cambridge University Press:  10 February 2011

R. Faust and
Q. Jiang
R. Faust
Affiliation:
SSEMATECH, 2706 Montopolis Drive, Austin, TX 78741–6499Texas Instruments, 13570 N. Central Expressway, Dallas, TX 75243
Q. Jiang
Affiliation:
National Semiconductor, 2900 Semiconductor Drive, Santa Clara, CA 95052–8090
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Abstract

The effect of various barrier materials on the microstructure of electroplated Copper films was investigated. Analysis of the Cu was performed at the as-deposited, room temperature stabilized, and annealed states. It shows that the barrier material can have a dramatic effect on the properties of electroplated Cu.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 564: Symposium N – Advanced Interconnects and Contacts , 1999, 421
Copyright
Copyright © Materials Research Society 1999

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References

1. Ritzdorf, T., Graham, L., S Jin, Mu, C., and Fraser, D., “Proceedings of the International Interconnect Technology Conference”, IEEE, 1998, pp. 166–168.Google Scholar
2. Jiang, Qing-Tang, Mikkola, Robert, Carpenter, Brad, and Thomas, Michael E., Adv. Metal. Conf., 1998, pp. 177–181.Google Scholar
3. Cabral, C., Andricacos, P., Gignac, L., Noyan, I., Rodbell, K., Shaw, T., Rosenberg, R., Harper, H., DeHaven, P., Locke, P., Malhotra, S., Uzoh, C., and Klepeis, S., Adv. Metal. Conf., 1998, pp. 81–87.Google Scholar
4. Lingk, C., Gross, M., Brown, W., Lai, W., Miner, J., Ritzdorf, T., Turner, J., Gibbons, K., Klawuhn, E., Wu, G., and Zhang, F., Adv. Metal. Conf., 1998 pp. 89–94.Google Scholar
5. Wong, S., Ryu, C., Lee, H., Loke, A., Kwon, K., Bhattacharya, S., Eaton, R., Faust, R., Mikkola, R., Mucha, J., and Ormando, J., IITC, 1998, pp. 107–109.Google Scholar
6. Wong, S. Simon, Ryu, Changsup, Lee, Haebum, and Kwon, Kee-Won, MRS, Vol. 514, 1998, pp. 75–81.10.1557/PROC-514-75Google Scholar
7. Jiang, Qing-Tang, Faust, Rick, Lam, Hieu“Robbie”, and Mucha, Jay, (to be presented), IEEE, International Interconnect Technology Conference, 1999.Google Scholar