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Chemical Interactions at Metal-Polymer Interfaces

Published online by Cambridge University Press:  22 February 2011

P. O. Hahn,
G. W. Rubloff,
J. W. Bartha,
F. Legoues,
R. Tromp and
P. S. Ho
P. O. Hahn
Affiliation:
IBM Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, N.Y. 10598
G. W. Rubloff
Affiliation:
IBM Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, N.Y. 10598
J. W. Bartha
Affiliation:
IBM Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, N.Y. 10598
F. Legoues
Affiliation:
IBM Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, N.Y. 10598
R. Tromp
Affiliation:
IBM Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, N.Y. 10598
P. S. Ho
Affiliation:
IBM Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, N.Y. 10598
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Abstract

This paper summarizes recent studies on metal-polymer interfaces for Cu, Ni and Cr on a high temperature polymer, polyimide. First some surface and bulk chemical properties of polyimide are described briefly, as measured with surface spectroscopies and verified by theoretical molecular orbital calculations. Then the chemical bonding and reactivity of the three interfaces are described and discussed in light of experimental observations of electronic structure, composition and interface morphology. The chemical trend of increasing reactivity of the interface is illustrated by comparing results from Cu to Cr.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984, 251
Copyright
Copyright © Materials Research Society 1985

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