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A Compact Planar Magnetron Plasma Sputtering Device for TiO2 Deposition

Published online by Cambridge University Press:  29 November 2013

Michelle Marie S. Villamayor,
Kenta Doi,
Edna Mae D. Cruz,
Freya Gay J. Avenir,
Motoi Wada and
Henry J. Ramos
Michelle Marie S. Villamayor
Affiliation:
National Institute of Physics, University of the Philippines – Diliman, Quezon City, 1101 Philippines.
Kenta Doi
Affiliation:
Graduate School of Science and Engineering, Doshisha University, Kyoto 610-0321, Japan.
Edna Mae D. Cruz
Affiliation:
Bulacan Agricultural State College, Pinaod, San Ildefonso, Bulacan, 3010 Philippines
Freya Gay J. Avenir
Affiliation:
Bulacan State University, Malolos City, 3000 Philippines
Motoi Wada
Affiliation:
Graduate School of Science and Engineering, Doshisha University, Kyoto 610-0321, Japan.
Henry J. Ramos
Affiliation:
National Institute of Physics, University of the Philippines – Diliman, Quezon City, 1101 Philippines.
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Abstract

A Compact Planar Magnetron Plasma Sputtering Deposition Device (CPM-PSDD) has been used to deposit TiO2 on silicon, glass and cotton cloth. An 80 mm diameter Ti target was placed at the cathode and was sputtered by argon-oxygen plasma with 10-20 mA discharge current and -300 V to -450 V discharge potential. Reactive oxygen gas fed into the system at 13:1 Ar:O2 sccm ratio for the deposition durations between one to four hours. The deposited films exhibited both anatase and rutile phases. Cotton cloths were dipped in methyl blue to evaluate the photocatalytic activity of the film.

Keywords

sputteringplasma-enhanced CVD (PECVD) (deposition)Ti

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Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1601: Symposium R – Photocatalysis , 2014, jsapmrs-13-1601
Copyright
Copyright © Materials Research Society 2013 

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References

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