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Composites for Electronic Substrate Applications

Published online by Cambridge University Press:  21 February 2011

R. Gerhardt
R. Gerhardt*
Affiliation:
Center for Ceramics Research, Rutgers University, P.O. Box 909, Piscataway, NJ 08855
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Abstract

The need for low dielectric constant, high thermal conductivity, matched thermal expansion and co-processability in electronic substrates is reviewed. Since no single phase material is able to satisfy all the requirements, a microscopic composite approach is proposed. Recent experimental evidence supporting the concept is also presented.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987, 101
Copyright
Copyright © Materials Research Society 1988

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References

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