Hostname: page-component-7b7567c8c-fvjsw Total loading time: 0 Render date: 2026-11-14T04:16:22.237Z Has data issue: false hasContentIssue false
  • English
  • Français

Computer Simulation of Materials Failure Processes in a Thermal or Radiational Environment

Published online by Cambridge University Press:  15 February 2011

S. Shimamura
S. Shimamura*
Affiliation:
Department of Applied Science, Faculty of Engineering, Yamaguchi University, Ube 755, Japan
Get access

Abstract

The surfaces of various materials are often exposed to such environments as thermal cycling or irradiation. The failure processes caused by microcrackings in such an environment are studied by means of computer simulations. Crack growth is modeled as a series of processes of storage, release, and transfer of strain energies in the cubic lattice system. Surface crack pattern, crack penetration, and strain energy distribution are investigated for systems in different situations. The simulations reveal some correlations between crack pattern, crack penetration, and strain energy distribution. The results have some implications on the failure processes of materials in a thermal or radiational environment. The reliability of materials is discussed on the basis of the results of simulations.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1. Burkhard, A. H., Kallis, J. M., Duncan, L. B., Kanninen, M. F., and Harris, D. O., in Advances in Fracture Research, Vol.2, edited by Salama, K., Ravi-Chandar, K., Taplin, D. M. R., and Rao, P. Rama (Pergamon Press, New York, 1989), p. 977.Google Scholar
2. Random Fluctuations and Pattern Growth: Experiments and Models, edited by Stanley, H. E. and Ostrowsky, N. (Kluwer Academic, Dordrecht, 1988), pp. 149–192.CrossRefGoogle Scholar
3. Statistical Models for the Fracture of Disordered Media, edited by Herrmann, H. J. and Roux, S. (North-Holland, Amsterdam, 1990).Google Scholar
4. Skjeltorp, A. T. and Meakin, P., Nature 335, 424 (1988).CrossRefGoogle Scholar
5. Kam, Tai-Yan, in Advances in Fracture Research, Vol.4, edited by Salama, K., Ravi-Chandar, K., Taplin, D. M. R., and Rao, P. Rama (Pergamon Press, New York, 1989), p. 2843.Google Scholar
6. Kameda, J. and Mao, X., J. Mater. Sci. 27, 983 (1992).CrossRefGoogle Scholar
7. Shimamura, S. and Kuriyama, K., J. Mater. Sci. 26, 6027 (1991).CrossRefGoogle Scholar
8. Shimamura, S. and Sotoike, Y., J. Mater. Res. 7, in press (1992).CrossRefGoogle Scholar
9. Gurarie, V. N. and Williams, J. S., J. Mater. Res. 5, 1257 (1990).CrossRefGoogle Scholar
10. Lutz, E. H., Swain, M. V., and Claussen, N., J. Am. Ceram. Soc. 74, 19 (1991).CrossRefGoogle Scholar