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Cracking in Thin Films and Substrates

Published online by Cambridge University Press:  22 February 2011

P. Ståhle and
C. F. Shih
P. Ståhle
Affiliation:
Department of Technology, Uppsala University, Uppsala, Sweden
C. F. Shih
Affiliation:
Division of Engineering, Brown University, Providence, RI, USA
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Abstract

A crack terminating perpendicularly at the bimaterial interface is analyzed. Stress distributions for a broad range of elastic moduli and yield strength mismatch are discussed. These results can be used to understand the effect of mechanical properties mismatch on the competition between crack deflecting into the interface and crack penetrating into the base material. The role of microdefects near the interface is explored.

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References

REFERENCES

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