Hostname: page-component-74656f9884-j7cmm Total loading time: 0 Render date: 2026-11-10T21:45:47.492Z Has data issue: false hasContentIssue false
  • English
  • Français

Deformable interconnects for conformal integrated circuits

Published online by Cambridge University Press:  11 February 2011

Stéphanie Périchon Lacour ,
Zhenyu Huang ,
Zhigang Suo  and
Sigurd Wagner
Stéphanie Périchon Lacour
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton NJ 08544
Zhenyu Huang
Affiliation:
Department of Mechanical & Aerospace Engineering and Princeton Material Institute, Princeton University, Princeton NJ 08544
Zhigang Suo
Affiliation:
Department of Mechanical & Aerospace Engineering and Princeton Material Institute, Princeton University, Princeton NJ 08544
Sigurd Wagner
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton NJ 08544
Get access

Abstract

The electro-mechanical response of thin gold layers evaporated onto silicone substrates is reported. Gold layers are prepared either thin and flat or thin and wavy on the compliant substrate. The electrical resistance of gold/silicone stripes is measured and analyzed during tensile deformation. For a 100-nm thick gold layer evaporated on a 1-mm thick silicone membrane, we have observed electrical continuity up to ∼ 22 % strain. This maximum strain decreases when the gold layer thickness is raised.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

Hsu, P.-H, Bhattacharya, R., Gleskova, H., Xi, Z., Suo, Z., Wagner, S. and Sturm, J.C., Appl. Phys. Lett. 81, 1723–5 (2002).Google Scholar
Pelrine, R., Sommer-Larsen, P., Kornbluh, R., Heydt, R., Kofod, G., Pei, Q., Gravesen, P., in Smart Structures and Materials 2001: Electroactive Polymer Actuators and Devices, edited by Bar-Cohen, Y., (SPIE Proc. 4329, Bellingham WA, 2001), pp. 335–349.Google Scholar
3 Lumelsky, V.J., Shur, M.S., Wagner, S., IEEE Sensors Journal 1, 41 (2001).Google Scholar
4 Kim, J., Lee, H.H., J. of Polymer Science B 39, 1122 (2001).Google Scholar
5 Huang, R., Suo, Z., J. of Appl. Phys. 91, 1135 (2002).Google Scholar
6 Bowden, N., Brittain, S., Evans, A.G., Hutchinson, J.W., Whitesides, G.W., Nature 393, 146 (1998).Google Scholar
7 Suo, Z., Ma, E. Y., Gleskova, H., Wagner, S., Appl. Phys. Lett. 74, 1177 (1999).Google Scholar