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Deposition of Gan Films Using Seeded Supersonic Jets

Published online by Cambridge University Press:  21 February 2011

H. Henry Lamb,
Ken K. Lai,
Victor Torres and
Robert F. Davis
H. Henry Lamb
Affiliation:
Department of Chemical Engineering, North Carolina State University, Raleigh, NC 27695-7905
Ken K. Lai
Affiliation:
Department of Chemical Engineering, North Carolina State University, Raleigh, NC 27695-7905
Victor Torres
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695-7907
Robert F. Davis
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695-7907
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Abstract

GaN films were deposited on sapphire (0001) from triethylgallium (TEG) and NH3 seeded in separate He free jets. as the dissociative chemisorption of NH3 is expected to be rate-limiting in GaN growth, the NH3/He nozzle temperature was varied to control the incident kinetic energy of the NH3 molecules. Using an NH3/TEG flow ratio of 205 and an NH3/He nozzle temperature of 400°C, stoichiometric films were deposited at substrate temperatures ≥530°C. Scanning electron microscopy revealed that films deposited at 580°C are polycrystalline α-GaN with randomly oriented 0.5-μm grains. Films with a closely similar morphology are deposited by using an NH3/He nozzle temperature of 90°C. IN contrast, films deposited at 580°C using an NH3/He nozzle temperature of 510°C consist of whiskers (aspect ratio = c A. 4) which exhibit a-GaN (0001)/sapphire (0001) heteroepitaxy, as evidenced by X-ray diffraction and reflection high-energy electron diffraction.

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